![]() ![]() By consolidating measurement systems onto a single, robust platform, including O2 ppm, vibration levels, vacuum, temperature profiles, and conveyor speed, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine. The Reflow Shuttle O2 delivers a detailed insight into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimisation. The Reflow Shuttle O2 enables granular monitoring of oxygen levels within each zone, allowing nitrogen consumption to be quantified and process issues detected such as oven sealing issues.ĬEO of Solderstar, Mark Stansfield said: "Reflow soldering demands precision and control. Oxygen can lead to oxide formation on metal surfaces during heating, purging the reflow process with nitrogen results in improved wetting and solder joint integrity. Precise control over O2 levels is paramount in electronics manufacturing due to its potential impact on solder joint quality. This ground-breaking consolidation of key parameters gives manufacturers comprehensive insights to make informed decisions and optimise their reflow soldering processes to achieve higher precision in their advanced soldering applications. The Reflow Shuttle O2 represents a significant advancement as the first repeatable verification tool that combines real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single robust platform. ![]()
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